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How to improve the problem of copper free holes in multi-layer PCB circuit boards?

Sep 09,2024

How to improve the problem of copper free holes in multi-layer PCB circuit boards?

1. Add high-pressure water washing and gel residue removal processes to holes that are prone to dust generation (such as holes with a diameter below 0.3mm containing 0.3mm).
2. Improve the activity and shaking effect of the medicine.
3. Change the printing screen and alignment film.
4. Extend the washing time and specify how many hours to complete the graphic transfer.
5. Set a timer.
6. Increase explosion-proof holes to reduce the stress on the board.
7. Regularly conduct penetration testing.

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