Manufacturing Capacity
| Factory 1(Circuit Engineering and Three Start) | Factory 2(Sunking PCB) | |
| ltem | Production capacity | |
| The highest layer | 12 | 16 |
| Thickness | 0.2-3.2mm | 0.3-5.0 |
| The smallest hole | 0.1mm | 0.1mm |
| Aspect ratio | 8:1 | 8:1 |
| Line width / Line gap ( Outer) | 3.0mil/3.0mil | 2.5mil/2.5mil |
| 3.0mil/3.0mil | 3.0mi/2.6mil | |
| Impedance control | +(-)7% | +(-)7% |
| copper thickness | 6 0Z | 70Z |
| Electroplating thick gold | Au 3 -50U" | Au0.8-60U" |
| Ni50-200U" | Ni50-200U" | |
| Emersion Gold(ENIG) | Au 1-4U" | Au0.8- 10U" |
| Ni 50-200U" | Ni 50-200U" | |
| Green oil thickness | 0.2mil --1.2mil | 0.2mil --1.2mil |
| Blue glue thickness | 4mil / 20mil | 4mil / 20mil |
Production process diagram
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